5787745-3 - TE Connectivity

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		LINA 明细表	PN Part Number ⁿ/ₐ	TEINTERNAL TE Internal # ⁿ/ₐ	TEINTERNALDESCRIPTION TE Internal Description ⁿ/ₐ	GROUNDCOMPONENTTYPE Ground Component Type ⁿ/ₐ	GROUNDINGOPTIONS Grounding Options ⁿ/ₐ	USBTYPE USB Type ⁿ/ₐ	USBVERSION USB Version ⁿ/ₐ	SIZE Size ⁿ/ₐ	CONNECTORSTYLE Connector Style ⁿ/ₐ	ORIENTATION Orientation ⁿ/ₐ	CONNECTORSYSTEM Connector System ⁿ/ₐ	CONNECTORCONTACTTERMINATESTO Connector & Contact Terminates To ⁿ/ₐ	LED ⁿ/ₐ	PRODUCTTYPE Product Type ⁿ/ₐ	NUMBEROFPORTS Number of Ports ⁿ/ₐ	NUMBEROFPOSITIONS Number of Positions ⁿ/ₐ	PANELGROUNDLOCATION Panel Ground Location ⁿ/ₐ	SHELLPLATINGFINISH Shell Plating Finish ⁿ/ₐ	SHELLPLATINGMATERIAL Shell Plating Material ⁿ/ₐ	CONTACTCURRENTRATINGMAXA Contact Current Rating Max [A]	CONTACTMATINGAREAPLATINGTHICKNESS Contact Mating Area Plating Thickness ⁿ/ₐ	CONTACTMATINGAREAPLATINGMATERIAL Contact Mating Area Plating Material ⁿ/ₐ	CONTACTTERMINATIONTYPE Contact Termination Type ⁿ/ₐ	TERMINATIONMETHODTOPRINTEDCIRCUITBOARD Termination Method to Printed Circuit Board ⁿ/ₐ	MOUNTINGLOCATION Mounting Location ⁿ/ₐ	LOCKINGFEATURE Locking Feature ⁿ/ₐ	PCBMOUNTRETENTIONTYPE PCB Mount Retention Type ⁿ/ₐ	CONNECTORMOUNTINGTYPE Connector Mounting Type ⁿ/ₐ	LOCATINGPOSTS Locating Posts ⁿ/ₐ	CENTERLINEPITCHMM Centerline Pitch [mm]	CENTERLINEPITCHIN Centerline Pitch [in]	HOUSINGCOLOR Housing Color ⁿ/ₐ	HOUSINGMATERIAL Housing Material ⁿ/ₐ	PCBTHICKNESSRECOMMENDED PCB Thickness [Recommended]	TAILLENGTH Tail Length ⁿ/ₐ	OPERATINGTEMPERATURERANGE Operating Temperature Range ⁿ/ₐ	CIRCUITAPPLICATION Circuit Application ⁿ/ₐ	INDUSTRYSTANDARD Industry Standard ⁿ/ₐ	PACKAGINGMETHOD Packaging Method ⁿ/ₐ	PACKAGINGQUANTITY Packaging Quantity ⁿ/ₐ

USB A RA STAK ASSY THRU H...

Printed Circuit Board

.76 um [ 29.92 uin ]

Gold or Gold Flash over P...

Through Hole - Solder

Through Hole - Solder

1.57 mm [ .062 in ]

2.84 mm [ .112 in ]

-55 - 85 C [ -67 - 185 F ...

Box & Tray, Tray

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